The HEROSYS DDR3 SODIMM (Small Outline DIMM) industrial memory module is meticulously designed in full compliance with JEDEC standards. It is purpose-built for space-constrained applications such as notebook PCs, compact industrial computers, and embedded systems.
Utilizing original DRAM chips from leading global manufacturers—Micron, SK Hynix, and Samsung—each module undergoes rigorous functional validation and compatibility testing to ensure outstanding performance, stability, and reliability even under prolonged operation and harsh industrial environments.
With its compact form factor and low power consumption, the HEROSYS DDR3 SODIMM is the ideal choice for embedded applications that demand strict control over size, energy efficiency, and system stability.
Features
Equipped with high-quality DDR3 DRAM chips from top-tier manufacturers (Micron / SK Hynix / Samsung)
No on-DIMM temperature sensor
Module height: 30.00 mm; pin pitch: 0.6 mm
204-pin dual in-line memory module (SODIMM)
Operating voltage: 1.35V (tolerance: +0.1V / –0.067V), 1.5V (tolerance: ±0.075V)
IC surface temperature range: 0°C to 85°C
Refresh cycle time at 0°C to 85°C: 7.8μs
Eight internal banks operating in parallel
Supports auto precharge option for each burst access
Supports auto-refresh and self-refresh operations
Lead-free, RoHS compliant
Halogen-free
Optional conformal coating / underfill for enhanced protection
Optional anti-sulfuration feature for harsh industrial environments