DDR3 SODIMM Memory Module

The HEROSYS DDR3 SODIMM (Small Outline DIMM) industrial-grade memory module is meticulously designed in full compliance with JEDEC standards. It is purpose-built for space-constrained applications such as notebook PCs, compact industrial computers, and embedded systems.

Utilizing original DRAM chips from leading global manufacturers—Micron, SK Hynix, and Samsung—each module undergoes rigorous functional validation and compatibility testing to ensure outstanding performance, stability, and reliability even under prolonged operation and harsh industrial environments.

The HEROSYS DDR3 SODIMM (Small Outline DIMM) industrial memory module is meticulously designed in full compliance with JEDEC standards. It is purpose-built for space-constrained applications such as notebook PCs, compact industrial computers, and embedded systems. 


Utilizing original DRAM chips from leading global manufacturers—Micron, SK Hynix, and Samsung—each module undergoes rigorous functional validation and compatibility testing to ensure outstanding performance, stability, and reliability even under prolonged operation and harsh industrial environments. 


With its compact form factor and low power consumption, the HEROSYS DDR3 SODIMM is the ideal choice for embedded applications that demand strict control over size, energy efficiency, and system stability.


Features

  • Equipped with high-quality DDR3 DRAM chips from top-tier manufacturers (Micron / SK Hynix / Samsung)

  • No on-DIMM temperature sensor

  • Module height: 30.00 mm; pin pitch: 0.6 mm

  • 204-pin dual in-line memory module (SODIMM)

  • Operating voltage: 1.35V (tolerance: +0.1V / –0.067V), 1.5V (tolerance: ±0.075V)

  • IC surface temperature range: 0°C to 85°C

  • Refresh cycle time at 0°C to 85°C: 7.8μs

  • Eight internal banks operating in parallel

  • Supports auto precharge option for each burst access

  • Supports auto-refresh and self-refresh operations

  • Lead-free, RoHS compliant

  • Halogen-free

  • Optional conformal coating / underfill for enhanced protection

  • Optional anti-sulfuration feature for harsh industrial environments

Model
DDR3 SODIMM
Memory technologyDDR3 Memory

Module Typ

SODIMM
Speed1333/1600 MT/s
Density4GB/8GB
FunctionNon-ECC Unbuffered Memory
Pin Number204pin
Bus Width x64
Voltage1.5V/1.35V
PCB Height1.18”
Operating Temperature0°C ~ 85°C (Tc)
Anti-SulfurationY
Recommended ApplicationFactory Automation/ Gaming/ Healthcare/ Internet of Things


Part Number
HSM-D3C4G1600HYMDDR3,4GB, 1600Hz,MT
HSM-D3C8G1600HYMDDR3,8GB, 1600Hz,MT





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